Since the retirement of the eda.org/vhdl.org server in 2013, the DIE format has been formally taken offline. This page is simply a way to revive the information for those still wishing to access it. Any and all versions found will be posted here for posterity sake. Newer standards have been developed in the intervening 20+ years1 2 3. But some still utilize this original, ground-breaking technology.
Initial Logic Modeling / Synopsys Version 1.0 release, 8 Apr 1994 (distributed on 3.5" floppy attached to 8.5x11" cardstock "flyder"):
Final Logic Modeling / Synopsys Version 1.0.3 release, 23 Nov 1994:
EIA SP-3468 Draft Ballot standard 1.0.1 release, 15 Nov 1994 and closed 22 March 1995 (distributed on 3.5" floppy disk with printout):
It is not known whether this ballot ever made it to the final standard format and what number EIA may have eventually assigned to it, if at all. If any later versions are ever discovered, they will be posted here for historical and education purposes. We presume, unless we hear otherwise, that any copyright holders have abandoned the work and thus allow the distribution and availability here. If informed otherwise, we will refer you to the appropriate place and contact to obtain the material.
The DIE format was developed as part of nChip Inc.'s overall MCM development contract with DARPA in the 1992 - 1994 time frame. At the time, it appeared Multi-Chip Module (MCM) packaging technology would take over as the preferred technique to pack ever more denser electronics in small spaces. nChip was a pioneer in silicon-based substrated modules (as opposed to the ceramic technology developed and used by IBM in their mainframes over the previous 20 years). Either form could take a flip-chip, solder-bumped die or a die that was wire bond or lead-frame connected to the substrate. Little did we know at the time that the same solder-ball bump technology used for bare die would get applied to ever smaller plastic packaging of die -- and thus achieving most of the performance and space gains of bare die. About the only reference to nChip's technology recently found is the archive of the Smithsonian exhibit created by the program in 1994.
The DIE format was developed concurrently with the I/O Buffer Information Specification (IBIS). IBIS had just started around the same time of the DIE effort did and its information was crucial to understand the non-package characteristics of the electronics delivered. Hence, DIE simply followed IBIS simple syntax format so one could be a proper subset of the other. As part of the DIE development, support was provided to the fledgling IBIS effort for standardization and industry-wide involvement. Hence both becoming draft EIA standards at the same time. EIA essentially folded (or no longer supported) standards activities just a mere 12 years later after many decades in existence.
It appears the DIE Format was mostly made available via the Gopher (like FTP) service on vhdl.org/eda.org until late 2003. It last appeared as a link on the home page of EDA.org in Oct 2003. The sub-folder link disappeared around the same time; a full 10+ years before the eda.org/vhdl.org server was finally retired. The vhdl.org/eda.org machine had been in existence for 4 years before InternetArchive began capturing it in 1997; and as an RBBS dial-up PC for 4 years before that.
A DIE Information Exchange Timing (DIET) format was under development later and never seems to have made it out of the Gopher directory listing. If copies of that document ever surface, it will be posted here.
Credit must be provided to Bill Acito of Cadence for tracking me down and bugging me over the last three years as some customers still relied on the DIE format in the Cadence tool suite for their machinery and environment. Although Cadence would love to retire the formats use, some customers just need to have it. And thanks also to Los Altos, CA friend Uday for keeping that old WinXP machine with a 3.5" floppy drive much to the dismay of his wife Kashmira who wanted it thrown away 15 years previously. Without that machine, I could find no way to extract the old archived copies. (This after discovering that maybe I did not have a backup of the original EDA.org server from when I left that activity in 2001 after all; at least not the gopher repository.)
Randy Harr
June 2017
1 Roughton, Mike "Standards on the Way for Bare-Die Procurement", 25 Jun 2001, EE Times
2 British Standards Institute "Data Requirements for Semiconductor Die BS PD ES 59008-1", 2000-, available from GloablSpec (some expired)
3 JEDEC (formerly EIA), "Procurement Standard for Semiconductor Die Products Including Known Good Die (KGD): JESD 49A", re-affirmed in 2009. No mention of DIE or IBIS but requests the same / similar information