Logic Modeling Group, Synopsys Inc.
                       MCM Bare Die Library Program
                     Copyright (c) 1994, Synopsys Inc.

Contents of the disk:

00README	- Information on DIE program and disk
contents.txt	- This file

die1-0		- DIE Format Reference Manual (version 1.0)
example		- DIE Format file containing 3 bare die description examples:
                    National Semiconductor SCAN 18245T MDA
                    Micron Semiconductor S01A 128Kx8 SRAM
                    Intel Corporation 80386 SX

Where the following extensions imply:

    .die	DIE Format File
    .ps, .eps	Postscript file format. (7-bit ASCII)
    .rtf	Microsoft WORD Rich Text format (7-bit ASCII)
    .txt	ASCII text file (7-bit ASCII)
    .zip	PKZIP 1.01 Compressed archive (binary)
    .Z		UNIX compressed file (binary)
    .tar	UNIX archive file (binary)
    .uu		UNIX uuencoded file (7-bit ASCII)

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*                           LEGAL NOTICE                                      *
*                                                                             *
* The information contained herein is provided for example purposes only      *
* during the evaluation of candidate Bare Die EDB interchange standards. The  *
* information contained herein is not necessarily accurate nor complete.      *
*                                                                             *
* This information should not be used for any purpose other than to evaluate  *
* the various candidate standard formats for representing Bare Die            *
* information electronically.  For accurate information on any part described *
* herein, contact the part manufacturer directly.                             *
*                                                                             *
* All information contained herein is copyright by Logic Modeling Group,      *
* Synopsys, Inc., or the respective, noted copyright holder.  Permission to   *
* copy this disk is given as long as the disk contents is copied in its       *
* entirety, not modified in any way, and used only for the purposes           *
* described above.                                                            *
*                                                                             *
*******************************************************************************

This work is sponsored by the Advanced Research Projects Agency, Application
Specific Electronic Module (ARPA ASEM) Program under contract MDA972-C-0002
via nCHIP Inc.